Diffuzionno-hardening solders based alloy gallium-indium-tin and powder of metal PCTSP5 reinforced with titanium
The paper considers a new composition of diffusion-hardening solder based on a low-melting gallium alloy and copper-tin spherical powder (PCTSP5). The influence of the powder filler – titanium composition on the structure and properties of solder for expanding the areas of use is investigated. Stren...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | Russian |
| Published: |
Tver State University
2018-12-01
|
| Series: | Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов |
| Subjects: | |
| Online Access: | https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-600.pdf |