Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires
A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnec...
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Series: | Journal of Nanomaterials |
Online Access: | http://dx.doi.org/10.1155/2011/268149 |
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doaj-808f0b7cec3e4f00a2f8d6087c21574a2020-11-24T22:29:49ZengHindawi LimitedJournal of Nanomaterials1687-41101687-41292011-01-01201110.1155/2011/268149268149Toward 3D Integration of 1D Conductors: Junctions of InAs NanowiresPhillip M. Wu0Lars Samuelson1Heiner Linke2Division of Solid State Physics and The Nanometer Structure Consortium (nmC@LU), Lund University, P.O. Box 118, 221 00 Lund, SwedenDivision of Solid State Physics and The Nanometer Structure Consortium (nmC@LU), Lund University, P.O. Box 118, 221 00 Lund, SwedenDivision of Solid State Physics and The Nanometer Structure Consortium (nmC@LU), Lund University, P.O. Box 118, 221 00 Lund, SwedenA vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies. We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires. The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire planar or 3D electronic devices.http://dx.doi.org/10.1155/2011/268149 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Phillip M. Wu Lars Samuelson Heiner Linke |
spellingShingle |
Phillip M. Wu Lars Samuelson Heiner Linke Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires Journal of Nanomaterials |
author_facet |
Phillip M. Wu Lars Samuelson Heiner Linke |
author_sort |
Phillip M. Wu |
title |
Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires |
title_short |
Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires |
title_full |
Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires |
title_fullStr |
Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires |
title_full_unstemmed |
Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires |
title_sort |
toward 3d integration of 1d conductors: junctions of inas nanowires |
publisher |
Hindawi Limited |
series |
Journal of Nanomaterials |
issn |
1687-4110 1687-4129 |
publishDate |
2011-01-01 |
description |
A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies. We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires. The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire planar or 3D electronic devices. |
url |
http://dx.doi.org/10.1155/2011/268149 |
work_keys_str_mv |
AT phillipmwu toward3dintegrationof1dconductorsjunctionsofinasnanowires AT larssamuelson toward3dintegrationof1dconductorsjunctionsofinasnanowires AT heinerlinke toward3dintegrationof1dconductorsjunctionsofinasnanowires |
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1725743021061832704 |