Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires

A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnec...

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Bibliographic Details
Main Authors: Phillip M. Wu, Lars Samuelson, Heiner Linke
Format: Article
Language:English
Published: Hindawi Limited 2011-01-01
Series:Journal of Nanomaterials
Online Access:http://dx.doi.org/10.1155/2011/268149