An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

An accurate and real-time knowledge of temperatures in insulated-gate bipolar transistor modules is crucial for reliability analysis and thermal management of power electronic converters. For this purpose, this paper establishes an integrated thermal equivalent circuit model comprising self-heating...

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Bibliographic Details
Main Authors: Mohsen Akbari, Mohammad Tavakoli Bina, Amir Sajjad Bahman, Bahman Eskandari, Edris Pouresmaeil, Frede Blaabjerg
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Access
Subjects:
Cross-heating effect
IGBTs
layers temperature
operating conditions
solder fatigue
thermal impedance model
Online Access:https://ieeexplore.ieee.org/document/9439476/

Internet

https://ieeexplore.ieee.org/document/9439476/

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