Analysis of Coplanar On-Chip Interconnects on Lossy Semiconducting Substrates
In this paper, a method for analysis and modeling of coplanartransmission interconnect lines that are placed on top ofsilicon-silicon oxide substrates is presented. The potential functionis expressed by series expansions in terms of solutions of the Laplaceequation for each homogeneous region of lay...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Spolecnost pro radioelektronicke inzenyrstvi
2002-04-01
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Series: | Radioengineering |
Online Access: | http://www.radioeng.cz/fulltexts/2002/02_01_01_05.pdf |