Analysis of Coplanar On-Chip Interconnects on Lossy Semiconducting Substrates

In this paper, a method for analysis and modeling of coplanartransmission interconnect lines that are placed on top ofsilicon-silicon oxide substrates is presented. The potential functionis expressed by series expansions in terms of solutions of the Laplaceequation for each homogeneous region of lay...

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Bibliographic Details
Main Authors: M. Stucchi, Roest, D. de, S. Vandenberghe, K. Maex, B. Nauwelaers, H. Ymeri
Format: Article
Language:English
Published: Spolecnost pro radioelektronicke inzenyrstvi 2002-04-01
Series:Radioengineering
Online Access:http://www.radioeng.cz/fulltexts/2002/02_01_01_05.pdf