High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

In this study, Ti−6Al−4V alloy was diffusion bonded to super-duplex stainless steel (SDSS) using an electrodeposited Cu interlayer containing alumina nanoparticles to determine the effects of bonding parameters on the microstructural evolution within the joint region. The results...

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Bibliographic Details
Main Authors: Kavian O. Cooke, Anthony Richardson, Tahir I. Khan, Muhammad Ali Shar
Format: Article
Language:English
Published: MDPI AG 2020-01-01
Series:Journal of Manufacturing and Materials Processing
Subjects:
stainless steel
titanium
diffusion bonding
nanoparticles
intermetallic compounds
grain size reduction
Online Access:https://www.mdpi.com/2504-4494/4/1/3

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