High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles
In this study, Ti−6Al−4V alloy was diffusion bonded to super-duplex stainless steel (SDSS) using an electrodeposited Cu interlayer containing alumina nanoparticles to determine the effects of bonding parameters on the microstructural evolution within the joint region. The results...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-01-01
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| Series: | Journal of Manufacturing and Materials Processing |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-4494/4/1/3 |