Condition Monitoring of IGBT Modules Based on Changes of Thermal Characteristics

Condition monitoring (CM) of insulated-gate bipolar transistor (IGBT) modules is significant for improving power converter reliability and reducing the loss caused by IGBT failure. In this paper, we present an advanced method to evaluate the aging condition of an IGBT based on the changes of thermal...

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Bibliographic Details
Main Authors: Kexin Wei, Wenbai Wang, Zhen Hu, Mingxing Du
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/8684837/