Improved Device Distribution in High-Performance SiN<sub>x</sub> Resistive Random Access Memory via Arsenic Ion Implantation

Large device variation is a fundamental challenge for resistive random access memory (RRAM) array circuit. Improved device-to-device distributions of set and reset voltages in a SiN<sub>x</sub> RRAM device is realized via arsenic ion (As<sup>+</sup>) implantation. Besides, th...

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Bibliographic Details
Main Authors: Te-Jui Yen, Albert Chin, Vladimir Gritsenko
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/11/6/1401