An integrated model for process parameter adjustment to recover throughput shortage in semiconductor assembly: A case study

Purpose: Existing productivity improvements activities such as inventory buffer, overall equipment effectiveness (OEE) and total productive maintenance (TPM) do not analytically associate the throughput shortage with process parameters. The paper aims to develop and test an integrated model to recov...

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Bibliographic Details
Main Authors: Ho Kok Hoe, Joshua Prakash, Shahrul Kamaruddin, Ong Kok Seng
Format: Article
Language:English
Published: OmniaScience 2019-07-01
Series:Journal of Industrial Engineering and Management
Subjects:
Online Access:http://www.jiem.org/index.php/jiem/article/view/2742