An integrated model for process parameter adjustment to recover throughput shortage in semiconductor assembly: A case study
Purpose: Existing productivity improvements activities such as inventory buffer, overall equipment effectiveness (OEE) and total productive maintenance (TPM) do not analytically associate the throughput shortage with process parameters. The paper aims to develop and test an integrated model to recov...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
OmniaScience
2019-07-01
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Series: | Journal of Industrial Engineering and Management |
Subjects: | |
Online Access: | http://www.jiem.org/index.php/jiem/article/view/2742 |