A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy
Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructu...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2015-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20152702003 |