Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder
In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-01-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/10/2/59 |