Dynamic Wet Etching of Silicon through Isopropanol Alcohol Evaporation

Dynamic Wet Etching of Silicon through Isopropanol Alcohol Evaporation

In this paper, Isopropanol (IPA) availability during the anisotropic etching of silicon in Potassium Hydroxide (KOH) solutions was investigated. Squares of 8 to 40 µm were patterned to (100) oriented silicon wafers through DWL (Direct Writing Laser) photolithography. The wet etching process was perf...

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Bibliographic Details
Main Authors: Tiago S. Monteiro, Pamakštys Kastytis, Luís M. Gonçalves, Graça Minas, Susana Cardoso
Format: Article
Language:English
Published: MDPI AG 2015-10-01
Series:Micromachines
Subjects:
isopropanol evaporation
isopropanol availability
silicon wet etching
microloading effect
Online Access:http://www.mdpi.com/2072-666X/6/10/1437

Internet

http://www.mdpi.com/2072-666X/6/10/1437

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