Extraction of Junction Temperature of SiC MOSFET Module Based on Turn-On dIDS/dt

In this paper, a method of extracting the junction temperature based on the turn-on current switching rate (dIDS/dt) of silicon carbide (SiC) metal-oxide semiconductor field effect transistors (MOSFETs) is proposed. The temperature dependence of dIDS/dt is analyzed theoretically, and experimentally...

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Bibliographic Details
Main Authors: Delei Huang, Guojun Tan, Chengfei Geng, Jingwei Zhang, Chang Liu
Format: Article
Language:English
Published: MDPI AG 2018-07-01
Series:Energies
Subjects:
Online Access:http://www.mdpi.com/1996-1073/11/8/1951
Description
Summary:In this paper, a method of extracting the junction temperature based on the turn-on current switching rate (dIDS/dt) of silicon carbide (SiC) metal-oxide semiconductor field effect transistors (MOSFETs) is proposed. The temperature dependence of dIDS/dt is analyzed theoretically, and experimentally to show that dIDS/dt increases with the rising junction temperature. In addition, other factors affecting dIDS/dt are also discussed by using the fundamental device physics equations and experiments. The result shows that the increase of the DC-link voltage VDC, the external gate resistance RG-ext, and the decrease of the driving voltage VGG can increase the temperature sensitivity of the dIDS/dt. A PCB (printed circuit board) Rogowski coil measuring circuit based on the fact that the SiC MOSFET chip temperature and dIDS/dt is estimated in a linear way is designed to obtain the junction temperature. The experimental results demonstrate that the proposed junction temperature extracting is effective.
ISSN:1996-1073