Effect of hexamethylenetetramine on surface smoothness of electroplated copper coating
In this paper, hexamethyltetramine is introduced into the electroplating bath to improve the surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used to study the effect of Cu(Ⅰ) and hexamethyltetramine on the electrochemical behaviors of el...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2021-01-01
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| Series: | E3S Web of Conferences |
| Online Access: | https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/43/e3sconf_icsce2021_02066.pdf |