Analysis and Experimental Test of Electrical Characteristics on Bonding Wire
In this paper, electrical characteristic analysis and corresponding experimental tests on gold bonding wire are presented. Firstly, according to EIA (Electronic Industries Association)/JEDEC97 standards, this paper establishes the electromagnetic structure model of gold bonding wire. The parameters,...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-03-01
|
| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/8/3/365 |