Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Abstract A reliable Cu–Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle paste. Pure copper nanoparticles used in the preparation of nanoparticle paste were synthesized through simple routes, with an average size of 60.5 nm. Under an Ar-H2 gas mixture atmosphere, the Cu na...

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Bibliographic Details
Main Authors: Junjie Li, Xing Yu, Tielin Shi, Chaoliang Cheng, Jinhu Fan, Siyi Cheng, Guanglan Liao, Zirong Tang
Format: Article
Language:English
Published: SpringerOpen 2017-04-01
Series:Nanoscale Research Letters
Subjects:
Cu–Cu bonding
Cu nanoparticles
Nanoparticle paste
Sintering
3D-IC
Online Access:http://link.springer.com/article/10.1186/s11671-017-2037-5

Internet

http://link.springer.com/article/10.1186/s11671-017-2037-5

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