Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.
Assessing the interfacial strength of multilayered structures is crucial to ensure the reliability of such components. Two widely used tests, four-point bending (4PB) and the stressed overlayer (SOL) technique, are juxtaposed and employed in this study to determine adhesion of WTi on borophosphosili...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-02-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127521000046 |