Bubble-free injection of liquid metal for the direct microfabrication of leaf-inspired 3D-topological conduit-networks and a flexible serpentine circuit with superior electrical resistance to aging
Flexible circuit boards are widely used in smart consumer electronic devices. In this paper, a novel methodology, which is different from the traditional etching and screen printing methods that generally rely on screen printed conductive ink as a conductor to form the required circuit in a dielectr...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2020-01-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.5125178 |