Electrodeposition and Properties of Copper Layer on NdFeB Device

• Main Authors: LI Yue, ZHU Li-qun, LI Wei-ping, LIU Hui-cong, NAN Hai-yang
• Format: Article
• Language: zho
• Published: Journal of Materials Engineering 2017-06-01
• Series: Journal of Materials Engineering
• Subjects: NdFeB; magnetic performance; HEDP complexing agent; copper layer; binding force
• Online Access: http://jme.biam.ac.cn/CN/Y2017/V45/I6/55

To decrease the impact of the regular Ni/Cu/Ni coating on the magnetic performance of sintered NdFeB device, alkaline system of HEDP complexing agent was applied to directly electro-deposit copper layer on NdFeB matrix, then nickel layer was electrodeposited on the copper layer and Cu/Ni coating was finally obtained to replace the regular Ni/Cu/Ni coating. The influence of concentration of HEDP complexing agent on deposition course was tested by electrochemical testing; morphology of copper layer was characterized by SEM, XRD and TEM; the binding force of copper layer and the thermal reduction of magnetic of NdFeB caused by electrodeposited coating were respectively explored through the thermal cycle test and thermal demagnetization test. The results show that the concentration of HEDP has great impact on the deposition overpotential of copper. In the initial electrodepositing stage, copper particles precipitate at the grain boundaries of NdFeB magnets with a preferred (111) orientation. The copper layer is compact and has enough binding force with the NdFeB matrix to meet the requirements in SJ 1282-1977. Furthermore, the thermal demagnetization loss rate of the sintered NdFeB with the protection of Cu/Ni coating is significantly less than that with the protection of Ni/Cu/Ni coating.