Electrodeposition and Properties of Copper Layer on NdFeB Device

Electrodeposition and Properties of Copper Layer on NdFeB Device

To decrease the impact of the regular Ni/Cu/Ni coating on the magnetic performance of sintered NdFeB device, alkaline system of HEDP complexing agent was applied to directly electro-deposit copper layer on NdFeB matrix, then nickel layer was electrodeposited on the copper layer and Cu/Ni coating was...

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Bibliographic Details
Main Authors: LI Yue, ZHU Li-qun, LI Wei-ping, LIU Hui-cong, NAN Hai-yang
Format: Article
Language:zho
Published: Journal of Materials Engineering 2017-06-01
Series:Journal of Materials Engineering
Subjects:
NdFeB
magnetic performance
HEDP complexing agent
copper layer
binding force
Online Access:http://jme.biam.ac.cn/CN/Y2017/V45/I6/55

Internet

http://jme.biam.ac.cn/CN/Y2017/V45/I6/55

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