3D MICROPACKAGING OF INTEGRATED CIRCUITS
A major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also, reliability concerns will be extremely important: electromigration and stress-migration. This paper pres...
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| Format: | Article |
| Language: | English |
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Technical University of Moldova
2020-03-01
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| Series: | Journal of Engineering Science (Chişinău) |
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| Online Access: | https://jes.utm.md/wp-content/uploads/sites/20/2020/03/JES-2020-1_28-35.pdf |