Non-Destructive Testing for Winding Insulation Diagnosis Using Inter-Turn Transient Voltage Signature Analysis

• Main Authors: Nadia Radja, M’hemed Rachek, Soraya Nait Larbi
• Format: Article
• Language: English
• Published: MDPI AG 2018-05-01
• Series: Machines
• Subjects: electromagnetic analysis; finite element; fourier transformer; insulation testing; RLC-circuits; skin and proximity effects; voltage wave
• Online Access: http://www.mdpi.com/2075-1702/6/2/21

The paper proposes a novel approach to assess the integrity of Electrical Insulation Systems (EIS) by evaluating the response of the Transient Voltage Signature Analysis (VSA) to voltage source inverters correlated with changes in the Insulation Capacitance (IC). The involved model structures are derived from the in-situ estimation of high-frequency electromagnetic RLMC lumped network parameters. Different physical phenomena such as inductive and capacitive effects, as well as skin and proximity effects are combined. To account for these phenomena, we use an approach based on equivalent multi-transmission line electric circuits with distributed parameters (R: resistances, L, M: self and mutual inductances, and C: capacitances) which are frequency-dependent. Using the finite element method, firstly the turn-to-ground and turn-to-turn capacitance parameters are performed by solving an electrostatic model with a floating electric potential approach, and secondly, the resistance and self/mutual inductances are computed from the strongly coupled magneto-harmonic and total current density equations, including the conduction and displacement eddy current densities. The sensitivity of the capacitances is measured according to insulation thickness, and the dielectric properties are adopted to test the degradation order scenarios of the EIS and comparing their time and frequency domains of transient voltage waveform behavior with respect to healthy assessed insulation systems.