Non-Destructive Testing for Winding Insulation Diagnosis Using Inter-Turn Transient Voltage Signature Analysis

Non-Destructive Testing for Winding Insulation Diagnosis Using Inter-Turn Transient Voltage Signature Analysis

The paper proposes a novel approach to assess the integrity of Electrical Insulation Systems (EIS) by evaluating the response of the Transient Voltage Signature Analysis (VSA) to voltage source inverters correlated with changes in the Insulation Capacitance (IC). The involved model structures are de...

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Bibliographic Details
Main Authors: Nadia Radja, M’hemed Rachek, Soraya Nait Larbi
Format: Article
Language:English
Published: MDPI AG 2018-05-01
Series:Machines
Subjects:
electromagnetic analysis
finite element
fourier transformer
insulation testing
RLC-circuits
skin and proximity effects
voltage wave
Online Access:http://www.mdpi.com/2075-1702/6/2/21

Internet

http://www.mdpi.com/2075-1702/6/2/21

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