Interfacial Thermal Conductivity and Its Anisotropy
There is a significant effort in miniaturizing nanodevices, such as semi-conductors, currently underway. However, a major challenge that is a significant bottleneck is dissipating heat generated in these energy-intensive nanodevices. In addition to being a serious operational concern (high temperatu...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2019-12-01
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Series: | Processes |
Subjects: | |
Online Access: | https://www.mdpi.com/2227-9717/8/1/27 |