Investigation of Microdevice Performance by Transient Heat Transfer Simulation
The present work considers transient electrothermal simulation of sub-micrometer silicon device and electron-phonon interactions in electrical and thermal fields. A coupled thermal and electrical model is developed for a silicon n n n structure consisting of the hydrodynamic equations for...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Isfahan University of Technology
2010-01-01
|
| Series: | Journal of Applied Fluid Mechanics |
| Subjects: | |
| Online Access: | http://jafmonline.net/JournalArchive/download?file_ID=15244&issue_ID=201 |