A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment

A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment

Temperature-humidity (TH) induced failure mechanism (FM) of metal contacting interfaces in integrated circuit (IC) systems has played a significant role in system reliability issues. This paper focuses on central processing unit (CPU)/motherboard interfaces and studies several factors that are belie...

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Bibliographic Details
Main Authors: Yupeng Li, Weiying Meng, Huaitao Shi, Zhijun Gao, Ke Zhang, Guochang Li, Bing Wang
Format: Article
Language:English
Published: MDPI AG 2019-09-01
Series:Applied Sciences
Subjects:
system reliability
Temperature-Humidity
induced failure mechanism
asperity
constriction
contacting area
contact resistance
contact tip design
Online Access:https://www.mdpi.com/2076-3417/9/19/3950

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https://www.mdpi.com/2076-3417/9/19/3950

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