Phase Change Materials for Thermal Management of IC Packages

Phase Change Materials for Thermal Management of IC Packages

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D whic...

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Main Authors: P. Fiala, I. Behunek
Format: Article
Language:English
Published: Spolecnost pro radioelektronicke inzenyrstvi 2007-06-01
Series:Radioengineering
Subjects:
Phase change
FEM
heat
integrated circuit
Online Access:http://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdf
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spelling doaj-664676c380d144229d1557d24c4136142020-11-24T23:40:58ZengSpolecnost pro radioelektronicke inzenyrstviRadioengineering1210-25122007-06-011625055Phase Change Materials for Thermal Management of IC PackagesP. FialaI. BehunekThis paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.www.radioeng.cz/fulltexts/2007/07_02_50_55.pdfPhase changeFEMheatintegrated circuit
collection DOAJ
language English
format Article
sources DOAJ
author P. Fiala
I. Behunek
spellingShingle P. Fiala
I. Behunek
Phase Change Materials for Thermal Management of IC Packages
Radioengineering
Phase change
FEM
heat
integrated circuit
author_facet P. Fiala
I. Behunek
author_sort P. Fiala
title Phase Change Materials for Thermal Management of IC Packages
title_short Phase Change Materials for Thermal Management of IC Packages
title_full Phase Change Materials for Thermal Management of IC Packages
title_fullStr Phase Change Materials for Thermal Management of IC Packages
title_full_unstemmed Phase Change Materials for Thermal Management of IC Packages
title_sort phase change materials for thermal management of ic packages
publisher Spolecnost pro radioelektronicke inzenyrstvi
series Radioengineering
issn 1210-2512
publishDate 2007-06-01
description This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
topic Phase change
FEM
heat
integrated circuit
url http://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdf
work_keys_str_mv AT pfiala phasechangematerialsforthermalmanagementoficpackages
AT ibehunek phasechangematerialsforthermalmanagementoficpackages
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