Phase Change Materials for Thermal Management of IC Packages

Phase Change Materials for Thermal Management of IC Packages

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D whic...

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Bibliographic Details
Main Authors: P. Fiala, I. Behunek
Format: Article
Language:English
Published: Spolecnost pro radioelektronicke inzenyrstvi 2007-06-01
Series:Radioengineering
Subjects:
Phase change
FEM
heat
integrated circuit
Online Access:http://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdf

Internet

http://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdf

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