Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies
This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjugate heat transfer in solid and fluid domains was u...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/13/5/1202 |