Self-Rectifying Twin-Bit RRAM in 3-D Interweaved Cross-Point Array

A new self-rectifying twin-bit RRAM in a novel 3-D interweaved cross-point array has been proposed and demonstrated in 28-nm high-k metal gate CMOS back end of line (BEOL) process. This high density of array architecture with the cell size only 70 × 100 × 187 nm can be manufact...

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Bibliographic Details
Main Authors: Shu-En Chen, Yung-Wen Chin, Min-Che Hsieh, Chu-Feng Liao, Tzong-Sheng Chang, Chrong-Jung Lin, Ya-Chin King
Format: Article
Language:English
Published: IEEE 2015-01-01
Series:IEEE Journal of the Electron Devices Society
Online Access:https://ieeexplore.ieee.org/document/7096920/