| Summary: | We have investigated the self-heating effect on DC and RF performances of identically fabricated AlGaN/GaN HEMTs on CVD-Diamond (GaN/Dia) and Si (GaN/Si) substrates. Self-heating induced device performances were extracted at different values drain bias voltage (VD) and dissipated DC power density (PD) in continuous wave (CW) operating condition. The effect of self-heating was observed much lesser in GaN/Dia HEMTs than GaN/Si HEMTs in terms of I<sub>D</sub>, I<sub>G</sub>, g<sub>m</sub>, f<sub>T</sub> and f<sub>max</sub> reduction. Increased channel temperature caused by joule heating at high PD reduces the 2-DEG carrier mobility in the channel of the device. This behaviour was also confirmed by TCAD simulation which showed ~3.9-times lower rising rate of maximum channel temperature and lowers thermal resistance (Rth) in GaN/Dia HEMTs than GaN/Si HEMTs. Small signal measurements and equivalent circuit parameter extraction were done to analyze the variation in performance of the devices. Our investigation reveals that the GaN/Dia HEMT is a promising candidate for high power density CW operation without significant reduction in electrical performance in a large drain bias range.
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