FS-MPC Based Thermal Stress Balancing and Reliability Analysis for NPC Converters
Active thermal control has been introduced to regulate the steady state and reduce the transient thermal-mechanical stress in power electronic modules. Specifically, it can equally distribute the temperature among the devices, thereby better distributing the stress among a set of devices and reducin...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9349179/ |