Tensile strengths and Young’s modulus of thin copper and copper-nickel (CuNi44) substrates

Tensile strengths and Young’s modulus of thin copper and copper-nickel (CuNi44) substrates

Bibliographic Details
Main Authors: Staller Oliver, Mitterbauer Christina, Mayr Katharina
Format: Article
Language:English
Published: De Gruyter 2008-12-01
Series:Open Chemistry
Subjects:
tensile strength
vickers hardness
textured tapes
cu substrates
coated conductors
Online Access:https://doi.org/10.2478/s11532-008-0076-6

Internet

https://doi.org/10.2478/s11532-008-0076-6

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