Facile synthesis of Cu10Sn3 nanoparticles and their sintering behavior for power device packaging
AbstractLow temperature nanojoining and high temperature service in the microelectronic packaging technology has received much focused attention. Here, we suggest a facile thermal decomposition method for preparation of Cu10Sn3 nanoparticles (NPs) with high bulk melting point (640 °C) by using comm...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-06-01
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| Series: | Results in Materials |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590048X21000200 |