Effect of Cu content on properties of Cu/Zn+15%SAC0307+xCu/Al joint by ultrasonic excitation at low temperature
The ultrasonic-assisted soldering joint of Cu/Al with different contents of copper particles added to solder powder at low temperature was studied. In this study, 15%SAC0307 solder powder with a diameter of 500 nm, different amounts copper particles with a diameter of 500 nm were mixed with zinc par...
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
|
| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330921000339 |