Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers
Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so-called low temperature bonding as a special direct bonding technology. It is carried out without intermediate layers and at temperatures...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2013-04-01
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| Series: | Frattura ed Integrità Strutturale |
| Online Access: | https://www.fracturae.com/index.php/fis/article/view/105 |