Development of thermal sensors by implantation ions P+ and B+ in different sides of Si(111)

In the method of high-phase ion implantation of P + and B + to different sides of monocrystal silicon we obtained p-i-n- structure, which has a high thermal sensitivity of 2.3 mV/K in a broad band temperature of (20 ÷ 550) K. We studied the distribution profile P and B atoms implanted in the Si grad...

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Bibliographic Details
Main Authors: I.R. Bekpulatov, A.S. Rysbaev, Sh.Kh. Dzhuraev, A.S. Kasymov
Format: Article
Language:English
Published: L.N. Gumilyov Eurasian National University 2018-12-01
Series:Eurasian Journal of Physics and Functional Materials
Subjects:
Online Access:http://ephys.kz/files/2018-12-24_0_Vol2_no4%20(9).pdf
Description
Summary:In the method of high-phase ion implantation of P + and B + to different sides of monocrystal silicon we obtained p-i-n- structure, which has a high thermal sensitivity of 2.3 mV/K in a broad band temperature of (20 ÷ 550) K. We studied the distribution profile P and B atoms implanted in the Si gradually decreasing energy. The effect of the subsequent thermal and annealing IR profile on the distribution of the atoms and the characteristics of the temperature sensor was studied.
ISSN:2522-9869
2616-8537