Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder
As an undisputed material of choice to guarantee reliability in a broad range of high performance and safety-critical applications in the electrical contacts and connectors, AuAgCu alloy was soldered with Ag-plated Cu wire using Sn-based solder. To clarify the embrittlement and strength reduction of...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2019-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2019/18/matecconf_iiw18_02005.pdf |