On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg<sub>2</sub>Si Composite
Transient liquid phase diffusion bonding of an aluminum metal matrix composite with 15 wt.% Mg<sub>2</sub>Si reinforcement particles using Cu powder interlayer at 560 °C for different bonding times has been studied. Three different zones were identified at the bonding line: athe...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-07-01
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| Series: | Journal of Composites Science |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-477X/3/3/66 |