Extreme environment interconnects and packaging for power electronics

Extreme environment interconnects and packaging for power electronics

This paper presents the combination of an innovative assembly and packaging process utilising solid liquid inter diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using additive manufacturing (AM). The resultant process chain supports the integration and...

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Bibliographic Details
Main Authors:	Alberto Campos-Zatarain, Jack Hinton, Maria Mirgkizoudi, Jing Li, Russell Harris, Robert W. Kay, David Flynn
Format:	Article
Language:	English
Published:	Wiley 2019-04-01
Series:	The Journal of Engineering
Subjects:	extrusion printing integrated circuit bonding three-dimensional printing integrated circuit packaging microfabrication assembling copper alloys power semiconductor devices high random frequency vibrations microextrusion printing methods power electronics bond strength solid liquid inter diffusion packaging micro-extrusion printing methods Cu-Sn
Online Access:	https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8118

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