Extreme environment interconnects and packaging for power electronics

Extreme environment interconnects and packaging for power electronics

This paper presents the combination of an innovative assembly and packaging process utilising solid liquid inter diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using additive manufacturing (AM). The resultant process chain supports the integration and...

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Bibliographic Details
Main Authors: Alberto Campos-Zatarain, Jack Hinton, Maria Mirgkizoudi, Jing Li, Russell Harris, Robert W. Kay, David Flynn
Format: Article
Language:English
Published: Wiley 2019-04-01
Series:The Journal of Engineering
Subjects:
extrusion
printing
integrated circuit bonding
three-dimensional printing
integrated circuit packaging
microfabrication
assembling
copper alloys
power semiconductor devices
high random frequency vibrations
microextrusion printing methods
power electronics
bond strength
solid liquid inter diffusion
packaging
micro-extrusion printing methods
Cu-Sn
Online Access:https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8118

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https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8118

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