Current collapse scaling in GaN/AlGaN/SiC high electron mobility transistors
This study reports the scaling of current collapse in GaN/AlGaN HEMTs with respect to the un-passivated gate drain distance on the gate edge. The source drain current reduction increased from 4 mA to 28 mA, when un-passivated gap increased from 200 nm to 600 nm respectively mainly due to virtual gat...
Main Authors: | D.S. Rawal, Amit, Sunil Sharma, Sonalee Kapoor, Robert Laishram, Seema Vinayak |
---|---|
Format: | Article |
Language: | English |
Published: |
KeAi Communications Co., Ltd.
2019-01-01
|
Series: | Solid State Electronics Letters |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2589208819300043 |
Similar Items
-
Comparative study of Au and Ni/Au gated AlGaN/GaN high electron mobility transistors
by: Ajay Kumar Visvkarma, et al.
Published: (2019-12-01) -
Analysis of Heat Dissipation in AlGaN/GaN HEMT with GaN Micropits at GaN-SiC Interface
Published: (2016) -
The characterization of AlGaN / GaN high-power transistor device structure in SiC and Si substrate
by: Chang, Hao-Ming, et al.
Published: (2011) -
Field Effect Transistor of AlGaN/GaN on Si Substrate
by: F.C.Lin, et al.
Published: (2006) -
The Growth of AlGaN/GaN Heterostructures on SiC Substrate by MOCVD for High Electron Mobility Transistor Applications
by: Huang, Shih-Che, et al.
Published: (2014)