Measuring the upset of CMOS and TTL due to HPM-signals

To measure the performance of electronic components when stressed by High Power Microwave signals a setup was designed and tested which allows a well-defined voltage signal to enter the component during normal operation, and to discriminate its effect on the component.</p><p style=&quot...

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Main Authors: N. Esser, B. Smailus
Format: Article
Language:deu
Published: Copernicus Publications 2004-01-01
Series:Advances in Radio Science
Online Access:http://www.adv-radio-sci.net/2/71/2004/ars-2-71-2004.pdf
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spelling doaj-5050d1e839004b978b775a65bae4c4122020-11-24T22:17:57ZdeuCopernicus PublicationsAdvances in Radio Science 1684-99651684-99732004-01-0127173Measuring the upset of CMOS and TTL due to HPM-signalsN. EsserB. SmailusTo measure the performance of electronic components when stressed by High Power Microwave signals a setup was designed and tested which allows a well-defined voltage signal to enter the component during normal operation, and to discriminate its effect on the component.</p><p style=&quot;line-height: 20px;&quot;> The microwave signal is fed to the outside conductor of a coaxial cable and couples into the inner signal line connected to the device under test (DUT). The disturbing HF-signal is transferred almost independent from frequency to maintain the pulse shape in the time domain. The configuration designed to perform a TEM-coupling within a 50 Ohm system prevents the secondary system from feeding back to the primary system and, due to the geometrical parameters chosen, the coupling efficiency is as high as 50–90%. Linear dimensions and terminations applied allow for pulses up to a width of 12ns and up to a voltage level of 4–5 kV on the outside conductor. These pulse parameters proved to be sufficient to upset the DUTs tested so far.</p><p style=&quot;line-height: 20px;&quot;> In more than 400 measurements a rectangular pulse of increasing voltage level was applied to different types of CMOS and TTL until the individual DUT was damaged. As well the pulse width (3, 6 or 12 ns) and its polarity were varied in single-shot or repetitive-shot experiments (500 shots per voltage at a repetition rate of 3 Hz). The state of the DUT was continuously monitored by measuring both the current of the DUT circuit and that of the oscillator providing the operating signal for the DUT.</p><p style=&quot;line-height: 20px;&quot;> The results show a very good reproducibility within a set of identical samples, remarkable differences between manufacturers and lower thresholds for repetitive testing, which indicates a memory effect of the DUT to exist for voltage levels significantly below the single-shot threshold.http://www.adv-radio-sci.net/2/71/2004/ars-2-71-2004.pdf
collection DOAJ
language deu
format Article
sources DOAJ
author N. Esser
B. Smailus
spellingShingle N. Esser
B. Smailus
Measuring the upset of CMOS and TTL due to HPM-signals
Advances in Radio Science
author_facet N. Esser
B. Smailus
author_sort N. Esser
title Measuring the upset of CMOS and TTL due to HPM-signals
title_short Measuring the upset of CMOS and TTL due to HPM-signals
title_full Measuring the upset of CMOS and TTL due to HPM-signals
title_fullStr Measuring the upset of CMOS and TTL due to HPM-signals
title_full_unstemmed Measuring the upset of CMOS and TTL due to HPM-signals
title_sort measuring the upset of cmos and ttl due to hpm-signals
publisher Copernicus Publications
series Advances in Radio Science
issn 1684-9965
1684-9973
publishDate 2004-01-01
description To measure the performance of electronic components when stressed by High Power Microwave signals a setup was designed and tested which allows a well-defined voltage signal to enter the component during normal operation, and to discriminate its effect on the component.</p><p style=&quot;line-height: 20px;&quot;> The microwave signal is fed to the outside conductor of a coaxial cable and couples into the inner signal line connected to the device under test (DUT). The disturbing HF-signal is transferred almost independent from frequency to maintain the pulse shape in the time domain. The configuration designed to perform a TEM-coupling within a 50 Ohm system prevents the secondary system from feeding back to the primary system and, due to the geometrical parameters chosen, the coupling efficiency is as high as 50–90%. Linear dimensions and terminations applied allow for pulses up to a width of 12ns and up to a voltage level of 4–5 kV on the outside conductor. These pulse parameters proved to be sufficient to upset the DUTs tested so far.</p><p style=&quot;line-height: 20px;&quot;> In more than 400 measurements a rectangular pulse of increasing voltage level was applied to different types of CMOS and TTL until the individual DUT was damaged. As well the pulse width (3, 6 or 12 ns) and its polarity were varied in single-shot or repetitive-shot experiments (500 shots per voltage at a repetition rate of 3 Hz). The state of the DUT was continuously monitored by measuring both the current of the DUT circuit and that of the oscillator providing the operating signal for the DUT.</p><p style=&quot;line-height: 20px;&quot;> The results show a very good reproducibility within a set of identical samples, remarkable differences between manufacturers and lower thresholds for repetitive testing, which indicates a memory effect of the DUT to exist for voltage levels significantly below the single-shot threshold.
url http://www.adv-radio-sci.net/2/71/2004/ars-2-71-2004.pdf
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