Solution for the Drift Problem of the Chip in the Packaging Process
This paper analyzes the drift phenomenon of the chips appearing in the packaging process of the fast recovery diode (FRD), and proposes an effective process to solve this problem. In order to improve the trade-off characteristics of fast recovery diodes, lifetime control methods, such as electron ir...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2018-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201823204044 |