Assembly Influence on the Small-Signal Parameters of a Packaged Transistor

Assembly Influence on the Small-Signal Parameters of a Packaged Transistor

A detailed analysis of the assembly influence onÃ‚Â thesmall-signal parameters of a packaged transistor is presented. A newmethod, based on 3D field simulation and mixed-mode scatteringparameters approach is proposed. Differences in scattering parameterscaused by assembly change are computed using t...

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Bibliographic Details
Main Authors:	Z. Skvor, K. Hoffmann, P. Cerny, V. Sokol
Format:	Article
Language:	English
Published:	Spolecnost pro radioelektronicke inzenyrstvi 2005-12-01
Series:	Radioengineering
Online Access:	http://www.radioeng.cz/fulltexts/2005/05_04_075_080.pdf

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