Assembly Influence on the Small-Signal Parameters of a Packaged Transistor
A detailed analysis of the assembly influence on thesmall-signal parameters of a packaged transistor is presented. A newmethod, based on 3D field simulation and mixed-mode scatteringparameters approach is proposed. Differences in scattering parameterscaused by assembly change are computed using t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Spolecnost pro radioelektronicke inzenyrstvi
2005-12-01
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| Series: | Radioengineering |
| Online Access: | http://www.radioeng.cz/fulltexts/2005/05_04_075_080.pdf |