Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography

Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography

5 nm logic process is the current leading-edge technology which is under development in world-wide leading foundries. In a typical 5 nm logic process, the Fin pitch is 22~27 nm, the contact-poly pitch (CPP) is 48~55 nm, and the minimum metal pitch (MPP) is around 30~36 nm. Due to the fact that these...

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Bibliographic Details
Main Authors: Yushu Yang, Yanli Li, Qiang Wu, Jianjun Zhu, Shoumian Chen
Format: Article
Language:English
Published: JommPublish 2020-03-01
Series:Journal of Microelectronic Manufacturing
Subjects:
5 nm logic process
euv
metal gate cut
sac
bac
self-aligned lele
Online Access:http://www.jommpublish.org/p/48/

Internet

http://www.jommpublish.org/p/48/

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