Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Unde...

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Bibliographic Details
Main Authors: Liangyu Wu, Xiaotian Han, Chenxi Shao, Feng Yao, Weibo Yang
Format: Article
Language:English
Published: MDPI AG 2019-06-01
Series:Energies
Subjects:
electronic device
flip chip component
thermal stress
thermal fatigue
life prediction
Online Access:https://www.mdpi.com/1996-1073/12/12/2391

Internet

https://www.mdpi.com/1996-1073/12/12/2391

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