FEM simulation of the size and constraining effect in lead free solder joints
Due to the ongoing miniaturization in microelectronics, the influence of dimensional constraining effects on the strength of solder joints becomes increasingly important. Detailed investigations show a strong dependence of tensile strength and ductility on solder geometry. This paper focuses on FEM...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
University of West Bohemia
2012-06-01
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| Series: | Applied and Computational Mechanics |
| Subjects: | |
| Online Access: | http://www.kme.zcu.cz/acm/index.php/acm/article/view/169/156 |